A major interest of ours arises from the recent introduction of integrated circuits used for the readout of many parallel signal channels. These newly available chips open the door to more complex measurement and imaging systems that were not possible just a few years ago.
We are among the first to begin exploiting these chips for the readout of pixellated semiconductor detectors. Their availability also has very strong implications for the future development of three-dimensional imaging devices. We have been the first to exploit this approach for the full three-dimensional readout of a CZT spectrometer, and the field will see a much broader introduction of these circuits in the years ahead.
Readout circuits fabricated in InGaP HBT technology, tested by a Network Analyzer for electrical performance.